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MECHANIC XZ10 0.35mm SOLDER BALL 10000 PCS


₹ 148.00 ₹ 500 70% off


1

Description

MECHANIC XZ10 0.35mm SOLDER BALL 10000 PCS

 

Features:

MECHANIC XZ10 0.35mm solder ball Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools The BGA solder ball has the following characteristics:

 

The BGA solder ball has the following characteristics:

 

  • MECHANIC solder ball 10000PCS/Bottle
  • Composition: Sn63/Pb37 ( 63% tin /  37% lead )
  • Meet EU ROHS and REACH standards.
  • With high reliability, excellent mechanical properties, good thermal fatigue resistance, and oxidation resistance.
  • Purity and sphericity are very high, with no surface defects.
  • Suitable for BGA, CSP, and other cutting-edge packaging technology and the use of micro-welding.
  • The minimum diameter of the solder ball is 0.35mm, non-standard sizes can be customized according to customer requirements.
  • When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.

 

Package Content

  • 1x MECHANIC XZ10(0.35mm) Solder Ball - 10000 Pieces (0.35mm)

MECHANIC XZ10 0.35mm SOLDER BALL 10000 PCS

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