AMAOE POSITIONING PLATE APPLE PCIE NAND
* Material: Japanese steel sheet
* Sternness: Super hard
* Hole type: Square
* Re-usable: Yes
* Thickness: 0.12MM
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Amaoe Nand BGA reballing stencil pamphlet EMMC / EMCP / UFS positioning platform steel plate for nand rework tool kit, EMMC/EMCP/UFS positioning platform + adjustment steel plate, iPhone baseband CPU NAND BGA reballing tin net stencils with magnetic base positioning fixture, AMAOE BGA stencil net set EMMC/EMCP/UFS font planting tin stencil BGA153/162/169/186/221/254 for Android mobile phones NAND rework tool
Option Types:
AMAOE MBGA-13 Pro Max STENCIL For IPHONE 13Pro Max MIDDLE LAYER MOTHERBOARD REBALLING
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