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Amaoe UN-2 CPU BGA Reballing Stencil for UMW2652 UMP510G UIP8910 UIS8910 UMS9230H SGM41512 BGA153 BGA200


₹ 159 ₹ 400 60% off


* Material: Japanese steel sheet

* Sternness: Super hard

* Hole  type: Square

* Re-usable: Yes

* Thickness: 0.12MM

1

Description

Amaoe UN-2 CPU BGA Reballing Stencil

Amaoe UN 2 CPU BGA Reballing Stencil for UMW2652 UMP510G UIP8910 UIS8910 UMS9230H SGM41512 BGA153 BGA200

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.


Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.


Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.


Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.


Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

 

Supported model:-

RR88916

UMW2652

UMP2652

UMP510G

BGA153

UIP8910

SGM41512

UIS8910

UMS9230H

BGA200

RR88643-21 RPM6743-31

SR3595D

Amaoe UN 2 CPU BGA Reballing Stencil

Verified Reviews

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