Home
All Categories
Mobile Repairing Tools
SMD Rework Station Power Supply Multimeters Microscope Separators Liquid & Glue Remover Moter Wire & Tape Cutters Soldering Iron Other Tools Blade Fixture & PCB Stand Mat & Rubber Opening Tools Set Paste Refurbished Screewdriver Toolkit Tweezers Power/Supply Cable Light Cloth Activation Board
Touch/Glass/OCA Glass
Mobile Touch Mobile Glass OCA Glass iPhone Oca Glass
AKT Spare Parts
Connector Jack Charging Flex Volume+Power Flex Mic Ringer Box Main LCD Flex Sim Tray Charging Socket Finger Sensor Camera Glass On-Off Switch Network Wire Back Button Sensor Ringer Battery Connector Mobile Speaker On Off Flex Volume Flex Speaker Jali
Stencils/IC/Motherboard
Stencils Mobile Phone IC Mobile Scrap Motherboard
OCA Machine & Parts
OCA Machine OCA Machine Parts Laser Machine
Mobile Accessories
Chargers Charging/Data Cable
Software
Software Box Software Activation
OCA Sheets & Polarizers
OCA Sheets Polarizers
CO2 Laser and Plotter
CO2 Laser Cutting Machines CO2 and Plotter Row Materials Plotters
Comming Soon
Shop By Brands
Sunshine AKT Brands Relife Mechanic Maxx Pamma Baku Quick Sugon EGO Brand Qianli Refurbished OSS Team Other LiuLon Brand 2UUL Brand Amaoe Stencil Rf4 Amaoe Tools Black Stencil Mechanic Stencil Combo Offer Sold Out
Customer Support View Cart
Upload Product Demand Repairing Training Course Login
  
0

AMAOE ZF3-012 For SAMSUNG ZFOLD 3 MIDDLE LAYER MOTHERBOARD REBALLING


₹ 150.00 ₹ 400 63% off


* Material: Japanese steel sheet

* Sternness: Super hard

* Hole  type: Square

* Re-usable: Yes

* Thickness: 0.12MM

1

Description

AMAOE ZF3-012 For SAMSUNG ZFOLD 3 MIDDLE LAYER MOTHERBOARD REBALLING

 

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.


Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.


Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.


Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.


Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

 

AMAOE ZF3-012 ZFOLD 3 STENCIL

Verified Reviews

Related Products

MU005X01-2 IC
₹ 191.00 ₹ 300
36% off    

1

SMB1350 ORIGINAL IC
₹ 61.00 ₹ 150
59% off    

1

Only 3 Product left!

AMAOE MZ-3 STENCIL
₹ 150.00 ₹ 400
63% off    

1

7219M-71 IC
₹ 26.00 ₹ 150
83% off    

2

Only 1 Product left!

AMAOE 339S00912 WIFI STENCIL
₹ 220.00 ₹ 600
63% off    

1

MECHANIC /AMAOE SU-1 STENCIL
₹ 69.00 ₹ 300
77% off    

1

84ADK11 2557 IC
₹ 37.00 ₹ 85
56% off    

1

Only 2 Product left!

AMAOE MAX-1 STENCIL For MAXIM MAX POWER
₹ 150.00 ₹ 400
63% off    

1