MECHANIC /AMAOE 6G/6P STENCIL
Precision stencil for iPhone repairs.
Durable stainless steel reballing tool.
Professional motherboard repair stencil template.
Accurate CPU IC solder positioning.
High precision laser-cut repair stencil.
Reusable mobile repair technician tool.
Reliable chip reballing repair accessory.
Heat resistant precision steel stencil.
Essential professional BGA repair template.
Perfect for motherboard chip repairs.
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The MECHANIC AMAOE 6G/6P Stencil is a premium-quality BGA reballing stencil specially designed for iPhone 6G and iPhone 6 Plus motherboard repair. Manufactured from high-grade stainless steel, this precision stencil ensures accurate solder ball alignment for CPU, IC, and chip-level rework.
Its ultra-precise laser-cut holes provide consistent solder ball placement, making it an essential tool for professional mobile phone repair technicians. The durable construction resists warping under high temperatures, allowing repeated use without compromising performance.
Ideal for mobile repair shops, service centers, and DIY electronics enthusiasts, the MECHANIC AMAOE 6G/6P stencil helps improve repair accuracy, reduce soldering errors, and achieve professional-quality reballing results.
| Specification | Details |
|---|---|
| Brand | MECHANIC AMAOE |
| Model | 6G/6P |
| Product Type | BGA Reballing Stencil |
| Material | High-Quality Stainless Steel |
| Compatible Devices | iPhone 6G, iPhone 6 Plus |
| Application | CPU IC Reballing |
| Heat Resistance | Yes |
| Precision | Laser Cut |
| Reusable | Yes |
| Suitable For | Mobile Repair Professionals |


