RELIFE RL-223-OR FLUX PASTE 100gm
* High-Quality Solder Paste for Phone Mainboard BGA SMD PCB Reballing Repair
* Running tin is fast, less smoke
* No-clean, easy to tin, no residue
* Applicable to mobile phone PCB, BGA, and PGA rework
* Lead-free
* Easy on the tin
* No residue
* High viscosity
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Features:
1. Original Japanese imported rosin, pure color, no impurities.
2. Good activity, strong viscosity, and good fluidity.
3. High insulation resistance, suitable for precision electronic maintenance such as mobile phone motherboards and CPU repair.
Packing Details: