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Relife RL-093B 0.3mm Heat Sink Copper Sheet


₹ 229 ₹ 500 54% off


  • RELIFE RL-039 IC Glue Remover (20ML) effectively removes epoxy and black glue from BGA ICs.

  • Specially formulated liquid for safe and precise IC glue cleaning.

  • Ideal for motherboard, PCB, and chip-level repair tasks.

  • Helps soften hardened adhesive for easier IC removal.

  • Designed for professional mobile phone repair technicians.

  • 20ML compact bottle for convenient workshop use.

  • Reduces risk of PCB damage during glue removal.

  • Suitable for BGA rework and micro-soldering preparation.

  • High-efficiency formula saves repair time and effort.

  • Essential consumable for electronics repair and refurbishment.

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Description

Relife RL-093B 0.3mm Heat Sink Copper Sheet

Relife RL-093 Series 12.45*14mm Chip Heat Sink Copper Sheet for Mainboard CPU Chip Cooling - 50Pcs
 

Features:

  • RL-093 B Chip heat sink copper sheet, rapid cooling efficient heat dissipation, 0.3 mm multiple specifications available
  • Efficient and uniform heat diffusion, with high thermal conductivity, it can quickly and evenly transfer heat from the chip to the heat sink, improving the overall heat dissipation effect
  • Strong corrosion resistance, with high corrosion resistance, it is not easy to oxidize or corrode, extending the service life of the heat sink
  • Multiple specifications available, 0.3 mm available
  • Uniform heat diffusion, during maintenance, can dissipate heat to nearby ICs to prevent solder from melting
  • Pure copper material, smooth surface without sharp edges or burrs
  • Efficient heat dissipation, high thermal conductivity, high heat dissipation efficiency


Package includes:

  • 50 x Copper Sheet

Relife RL-093B 0.3mm Heat Sink Copper Sheet

Relife RL-093B 0.3mm Heat Sink Copper Sheet

Relife RL-093B 0.3mm Heat Sink Copper Sheet

Relife RL-093B 0.3mm Heat Sink Copper Sheet

Relife RL-093B 0.3mm Heat Sink Copper Sheet

Relife RL-093B 0.3mm Heat Sink Copper Sheet

 

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