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MaAnt IP17 Series Mid-level Tin Plating Platform


₹ 529 ₹ 1000 47% off


  • MaAnt 0.12mm Magnetic Middle Layer BGA Reballing Platform

  • Designed for iPhone X to iPhone 14 Pro Max Motherboard Repair

  • High-precision 0.12mm thickness for accurate BGA alignment

  • Magnetic design ensures firm PCB fixing during reballing

  • Ideal for CPU, NAND, Baseband, IC reballing work

  • Durable metal build, heat-resistant & warp-free

  • Suitable for professional mobile repair technicians

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Description

MaAnt IP17 Series Mid-level Tin Plating Platform

MaAnt 0.12mm Magnetic Middle Layer BGA Reballing Platform Set for iPhone X to 14Pro Max Motherboard

  • Original MaAnt Magnetic Middle Layer Reballing Platform Set

  • Specially designed for iPhone X, XS, XR, 11, 11 Pro, 12, 13, 14 & 14 Pro Max motherboards

  • 0.12mm ultra-thin precision layer ensures perfect solder ball height

  • Strong magnetic holding system keeps motherboard stable during reballing

  • Helps in accurate IC positioning and prevents PCB movement

  • Compatible with BGA reballing, CPU repair, NAND repair & logic board work

  • High-quality alloy metal for long life and repeated heating cycles

  • Anti-deformation & high-temperature resistant material

  • Improves repair success rate and working efficiency

  • Widely used in advanced iPhone motherboard repairing

  • Best choice for repair shops, technicians & training centers

 

Package includes:
1 x Positioning plate
4 x Steel mesh
1 x Blade

MaAnt IP17 Series Mid-level Tin Plating Platform

MaAnt IP17 Series Mid-level Tin Plating Platform

MaAnt IP17 Series Mid-level Tin Plating Platform

MaAnt IP17 Series Mid-level Tin Plating Platform

MaAnt IP17 Series Mid-level Tin Plating Platform

MaAnt IP17 Series Mid-level Tin Plating Platform

Verified Reviews

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