Sunshine LS4 Intelligent Glue Removal Heating Machine
Chip glue removal
Separation preheating
Temperature up to 380°C
Multi-function heating machine
Modular Design,Strong Compatibility
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1. Suitable for tinning, removing chip glue, separation preheating, and mainboard layering.
2. Modular design, Strong compatibility, can be switched freely according to needs.
3. Large operating area, supports larger motherboard desoldering operations, convenient and fast.
4 .CNC precise temperature adjustment, starting from the current ambient temperature, up to 380?, according to different work needs, for efficient use.
5. Specially made thickened aluminum plate, rapid heating, even heating, and fast and efficient repair.
Specification:
Package includes:


